According to CoinMeta, the 24th China Semiconductor Packaging and Testing Technology and Market Annual Conference (referred to as "Packaging and Testing Annual Conference") will be held at Nanjing Fengda International Hotel from November 4th to 6th. During these two days of conferences, leading enterprises in the fields of semiconductor packaging and testing, chip design, glass substrates, and advanced packaging and testing equipment, such as Huatian Technology, Changdian Technology, Tongfu Microelectronics, Nanjing TSMC, Birun Technology, BOE Technology, and Yuntian Semiconductors, will exchange the latest development trends in advanced packaging through main forums, special reports, supply-demand matchmaking sessions, and other formats. Currently, as Moore's Law approaches its physical limits and AI computing power continues to develop rapidly, semiconductor packaging and testing technology is evolving continuously. Advanced packaging and testing are becoming an important force in driving improvements in chip performance and industrial innovation, and they have also become a new strategic high ground for the development of the semiconductor industry.