CyberTAN Technology, Inc. They released the blueprint for the Pallas series of liquid-cooled 102.4 Tbps Ethernet switch platform on OCP Global Summit 2026, and stated that they are collaborating with Marvell to create a fully liquid-cooled 102.4 Tbps T100 Ethernet switch platform blueprint.
This network equipment supplier stated that it has launched a new Pallas series of 1.6T Ethernet switch platform architectures, designed to support Marvell ® Teralynx ® T100 102.4 Tbps switching chips, while also providing industry-leading power efficiency ( PUE ) performance.
According to CyberTAN, with the rapid expansion of generative AI and ultra-large-scale workloads, data centers need to innovate in chip efficiency and rack-level thermal management. The Pallas series of platforms are fully compatible with Marvell's 3nm T100 architecture, maximizing the chip's 25% energy-saving advantage while increasing port density. By combining the Marvell chip blueprint with CyberTAN's proprietary direct-contact chip ( D2C ) liquid cooling technology, this platform is designed to handle local heat dissipation of over 1,000 watts and help data centers achieve higher levels of environmental sustainability.
CyberTAN Chairman and CEO GwongYih Lee stated: "Our collaboration with Marvell marks a key milestone in bringing the mass-producible 1.6T connectivity architecture to market. By designing the Pallas series around the Marvell T100 chip specifications, we are providing high-density, low-latency network switch designs for global hyperscale cloud service providers, pushing the boundaries of PUE optimization and thermal control."
Marvell, Vice President and General Manager of Cloud Exchange Business Department, Rishi Chugh said: " Marvell is committed to building an open and robust infrastructure ecosystem for the AI era. The Pallas series of platform architectures from CyberTAN demonstrate well how the industry can design systems to take advantage of the massive bandwidth and energy-saving capabilities of our 3nm T100 chips, overcoming traditional network bottlenecks."
At the OCP 2026 event, attendees can visit the B29 booth to learn about the pre-development switch platform of CyberTAN. The on-site display includes an integrated architecture prototype with a complete schematic circuit board, optical enclosure, and internal wiring, and is equipped with a dedicated thermal module to simulate the workload of T100 chips. Visitors can also watch a dynamic liquid cooling flow demonstration driven by a coolant distribution unit ( CDU ). This demonstration is equipped with multiple temperature sensors to verify that the platform can safely handle 40W OSFP ZR / ZR + optical modules at a liquid inlet temperature of 45 degrees Celsius, and achieves an industry-leading PUE of 1.1.
Regarding CyberTAN Technology, Inc.
CyberTAN Technology, Inc. Founded in 1998, it is a global manufacturer of broadband access and advanced network infrastructure, with its headquarters located in Taiwan, and has business layouts around the world. CyberTAN focuses on enterprise switches, wireless connection solutions, and next-generation AI data center hardware architectures. The company is committed to providing sustainable, low-latency, and high-efficiency network products to global hyperscale cloud service providers, telecommunications operators, and enterprise customers using green technologies and high engineering capabilities.
