GigaDevice Technology Reclaims First Place on the A-share Market, with Market Value Returning to 3 Trillion
The Block
57m ago
Ai Focus
Storage chip concept stocks saw a sharp rise in the morning session today, with ChangXin Technology rising by over 5%. Its market value returned to 3 trillion yuan, once again surpassing Industrial and Commercial Bank of China to become the largest in the A-share market. The company previously disclosed the research and development progress of its 4F2 DRAM architecture and plans to use the excess funds raised to advance the research and development as well as the back-end testing base project for memory wafers.
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News from the IT Home on October 16th: Storage chip concept stocks saw a significant rise in the morning session today. As of the time of this report by the IT Home, ChangXin Technology has risen by over 5%, with its market value returning to 3 trillion, once again surpassing Industrial and Commercial Bank of China to become the largest A-share company by market value.

According to a report by IT on October 10th, ChangXin Memory has made key progress in the development of its 4F2 DRAM architecture. Dr. Cao Kanyu, the company's president, delivered a speech at the 4th Integrated Chips and Chiplets Conference, where he provided a comprehensive overview of ChangXin Memory's technological explorations and advancements in DRAM devices, 4F2 architecture, and hybrid bonding. He also officially announced that a new generation of DDR5 RDIMM products incorporating these advanced technologies is expected to be launched by the end of the year.

On the evening of September 28, ChangXin Technology announced that it plans to use 13 billion yuan of excess funds to invest in new technology research and development projects. At the same time, it intends to provide an additional 5 billion yuan of excess funds to its wholly-owned subsidiary, ChangXin Storage Products (Hefei) Co., Ltd., through capital increase and borrowing. This funds will be used by the subsidiary to invest in the second phase of a new memory wafer post-production testing base project.

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