San Jose, USA, November 11th / PRNewswire / -- Super Micro Computer, Inc. (Nasdaq ticker: SMCI), a provider of AI, enterprise, storage, and comprehensive 5G/edge solutions that utilize Data Center Building Block Solutions ® ( DCBBS ), today announced that its H15 generation of server products is now in shipment. This product portfolio is equipped with the 6th generation AMD EPYC 9006 series processors (previously codenamed “ Venice ”), which are a core component of the Supermicro DCBBS architecture. The system has been optimized for the next generation of GPU, including AMD Instinct accelerators, and is capable of providing rack-level performance designed for the Agentic AI era, helping customers to deploy high-performance AI infrastructure more quickly.
Supermicro Senior Vice President of Marketing, Michael McNerney, stated: "As the H15 product portfolio begins to be shipped, Supermicro and AMD are providing customers with a faster and more efficient Agentic AI infrastructure solution. Built on our DCBBS architecture and powered by the 6th generation AMD EPYC 9006 processor, these servers offer significant improvements in core density, memory bandwidth, and PCIe throughput. Our close engineering collaboration with AMD gives customers the flexibility to confidently scale their AI, cloud, and enterprise workloads."
AMD, the Senior Vice President and General Manager of AI, stated: "Shipping the latest high-performance AMD EPYC processors is crucial for driving the development of AI organizations of all sizes. Our close collaboration with Supermicro ensures that customers receive optimized platforms that combine leading CPU performance with Instinct GPU and AMD Pensando™ networks, as well as a modular design. These platforms help organizations to deploy AI infrastructure more quickly, improve utilization rates, reduce energy consumption, and lower total cost of ownership, while also running more concurrent intelligent agents and enterprise workloads with higher requirements."
Learn more about the Supermicro H15 proxy server, and click here to watch a brief video summary of this release.
The immediately deliverable H15 server product portfolio includes high-density systems optimized for cloud, HPC, and Agentic AI workloads. These systems achieve outstanding performance on 2U Hyper and CloudDC platforms and have set several SPEC CPU world records. Supermicro offers a wide range of server product lines, from performance workstations and edge systems to high-density multi-node, enterprise-level GPU servers, enabling Supermicro to serve as a one-stop partner for data centers, CPU, GPU, and storage solutions. Meanwhile, Supermicro is expanding its rack-level infrastructure, powered by AMD CPU and GPU, and launching new Helios and Helion platforms that provide end-to-end options for deployments ranging from Agentic to ultra-large-scale AI.
DCBBS provided by Supermicro offers a complete and modular AI infrastructure, with end-to-end deployment flexibility, enabling the delivery of the latest AMD driven data center solutions to customers at a faster time-to-market rate. By combining DCBBS design with AMD servers, CPU, GPU, and network architecture, it helps customers bring the next generation of AI infrastructure to market more quickly, resulting in 33% more cores, 2 times the PCIe bandwidth, and 2.6 times higher memory bandwidth. Both parties stated that this enables Supermicro and AMD to provide enterprise customers with 1.8 times the number of token per second compared to the previous generation of AMD CPU, making it suitable for cutting-edge model host nodes.
The comprehensive product portfolio of Supermicro includes more than 20 optimization systems, such as:
- CloudDC — A single-path system designed for cloud-scale environments, based on the Open Computing Project (OCP) data center modular hardware system (DC-MHS) specifications, and adopts open data center standards.
- FlexTwin ™ – 1 OU ( ORv3 ), dual-node, liquid-cooled, high-performance, high-density dual-path computing system, designed for cloud-native and ultra-large-scale deployments
- GrandTwin ® – High-density 2U dual-node, single-path architecture, designed for object storage, virtualization, cloud services, and HPC and other horizontal scaling environments
- Petascale Storage — A high-capacity all-flash storage platform optimized for AI data lakes based on software-defined storage, large-scale analytics, and HPC environments. A single system supports up to 4.8 PB.
- SuperBlade ® —— H15 6U SuperBlade Supports both single-channel and dual-channel blade configurations, offering both air-cooled and liquid-cooled versions, optimized for maximum density, high performance, and high efficiency.
Next-generation rack-level data center solutions
Supermicro and AMD are working closely together to bring Helios and Helion rack-level solutions to market, providing enterprise customers with a complete end-to-end AI infrastructure. Both solutions are optimized for large-scale and Agentic AI deployments, but with different focuses. Helios aims for maximum GPU performance and is equipped with AMD Instinct MI455X GPU for accelerating cutting-edge model training and high-throughput inference. Helion, on the other hand, emphasizes computational performance and deployment flexibility, and is built based on the latest 6th generation AMD EPYC CPU.
Both solutions can be seamlessly integrated with the DCBBS architecture of Supermicro, combining rack-level system design, leading AMD AI computing power, and innovative integration software into a unified platform.
Discover how Supermicro DCBBS can help build and expand your next-generation AI infrastructure.
Regarding Super Micro Computer, Inc.
Supermicro (Nasdaq ticker: SMCI) is a global leader in application-optimized, end-to-end IT solutions. Headquartered in San Jose, California, the company is dedicated to providing market-leading innovations for enterprises, cloud, AI, and 5G telecommunications/edge IT infrastructure. The company offers comprehensive IT solutions that include servers, AI, storage, Internet of Things, switching systems, software, and support services. Its expertise in motherboard, power supply, and chassis design further enhances its development and manufacturing capabilities, enabling the company to provide next-generation innovations for customers worldwide, from the cloud to the edge. The company's products are designed and manufactured in the United States, Taiwan, Malaysia, the Netherlands, and other locations, leveraging global operations to achieve scalability and efficiency, while also optimizing total cost of ownership and reducing environmental impact (green computing). Its award-winning Server Building Block Solutions ® product portfolio allows customers to choose from a wide range of systems optimized for specific workloads and applications; these systems consist of flexible and reusable building blocks that support a full range of form factors, processors, GPU, storage, networking, power supply, and cooling solutions (air cooling, natural air cooling, or liquid cooling).
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