News from the IT family on October 22nd: Micron (Micron) held its annual technology webinar yesterday local time, where they looked ahead to DRAM, pan-HBM, NAND, and SSD. This article focuses on the pan-HBM memory products that feature stacked integration.
Micron expects that in 2028, when the standard HBM5 will be released, there will also be two new types of 3DS memory, namely vHBM and vEIM.
vHBM can be understood as a 3D integrated version of HBM. It utilizes vertically stacked DRAM Die, Base Die, and XPU logic main chips, which can further shorten the data communication path, improve bandwidth efficiency, and reduce energy consumption. vHBM can also coexist with standard 2.5D HBM.
vEIM is structurally similar to vHBM, but its design is aimed at the end-user side AI inference scenarios. The initial product aims to achieve a bandwidth of 2TB/s and an energy efficiency of <1pj / bit.
To achieve vHBM and vEIM, Micron plans to apply bump-free hybrid bonding technology and introduce integrated cooling solutions.
