LG Innotek and NVIDIA collaborate to further layout the physical AI market
PR Newswire
1h ago
Ai Focus
LG Innotek is collaborating with NVIDIA to develop sensing solutions for physical AI and robots, and showcased a 3-megapixel camera module and multimodal vision system for NVIDIA Holoscan Sensor Bridge at the GTC in Berlin. The company stated that in the future, the collaboration will also expand to areas such as robot vision perception and humanoid robot hands.
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BERLIN, on October 22, 2026 / PRNewswire / -- LG Innotek (CEO Moon Hyuksoo, 011070) stated that they are collaborating with NVIDIA to create sensing solutions for physical AI and robots. This marks an important step forward for the company in its efforts to gain a leading position in the physical AI market.

At the GTC Berlin held in Berlin, Germany on October 20th, LG Innotek showcased its latest sensing solutions, including a 3-megapixel (MP) camera module and a multimodal vision system (MVS). These solutions are aimed at realizing NVIDIA Holoscan Sensor Bridge (HSB) technology, in order to provide real-time sensor connectivity to GPU.

GTC is an annual global development and business strategy conference organized by NVIDIA, focusing on the latest technological trends in fields such as GPU, AI, and autonomous driving. This event brings together leading technology companies around the world, including Microsoft and Amazon, as well as key industry participants that rely on the NVIDIA platform and technology to conduct their business.

HSB is an open-source Ethernet connection architecture for sensors developed by NVIDIA. With this technology, the information collected by sensors can be sent directly to AI computers without going through CPU, thus creating a "data highway". NVIDIA Holoscan Platform can help physical AI systems, including autonomous vehicles and robots, process information more quickly and make decisions more swiftly. The industry considers HSB to be the core technology that will lead the future physical AI ecosystem.

The fusion sensing capabilities of LG Innotek include cameras, LiDAR, and radar, which are built upon the company's world-class optical design expertise accumulated in the fields of mobility, autonomous driving, and robotics.

An official stated, "This collaboration will enable us to expand our cooperation with global physical AI companies that use the NVIDIA platform and increase opportunities to supply cameras and sensing solutions equipped with HSB technology."

Looking to the future, both parties plan to expand their cooperation in physical AI sensing solutions, including humanoid robot vision perception and robot hands that can be integrated with HSB technology and NVIDIA's next-generation platform. The two sides will also continue to work closely together, with plans to showcase these solutions at next year's CES and GTC.

At the same time, LG Innotek is actively seeking future business opportunities by leveraging its highly scalable core technologies, which include sensing, substrate, and control technologies developed in collaboration with major global technology clients. Especially in the physical AI sectors such as autonomous driving and robotics, the company is accelerating its efforts to rapidly build engines for future growth.

In the field of autonomous driving, LG Innotek established a "strategic partnership" with Aeva, a technology leader in the United States, last year. This year, the company has also launched cooperation with Applied Intuition, a US-based autonomous driving software company, as well as Kakao Mobility, South Korea's largest mobility platform company, to jointly develop autonomous driving solutions.

In the field of robotics, the company is also taking swift action by developing robot components with Boston Dynamics and has begun mass-producing camera modules for robotic customers in North America, in order to establish a firm foothold in the market as soon as possible.

CEO Moon Hyuksoo stated, "The collaboration with NVIDIA further demonstrates the technical competitiveness of LG Innotek." He added, "This partnership provides us with an excellent opportunity to rapidly expand our differentiated integrated sensing solutions in the global market. As a 'physical AI overall solution provider' that covers not only sensing but also communication modules and semiconductor substrates, we will quickly gain a foothold in the physical AI solution market."

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