Taipei, October 29th / PRNewswire / -- Hon Hai Technology Group ( Foxconn ) ( TWSE : 2317 ) announced on Friday that during the 7th Hon Hai Technology Day 2026 ( HHTD26 ), the company showcased for the first time components and system technologies that support the infrastructure of the next generation of AI. It also highlighted its long-term partnerships, further confirming its leading position in the industry regarding "token factory" solutions.
Hon Hai stated that at this event, the company showcased its work around the NVIDIA Vera Rubin platform, demonstrating its vertical integration and precision manufacturing capabilities ranging from the integration of complete AI supercomputing systems at the rack level to the manufacturing technology of sub-micron-level components.
In two “first-time” presentations, Hon Hai showcased NVIDIA DSX POD. This is a standardized, factory-prepared reference design that allows partners to pre-integrate NVIDIA Vera Rubin rack-level AI infrastructure within modular containers, complete key verifications before shipment, and then connect it to the prepared on-site infrastructure upon delivery. This exhibition area became a focal point, attracting visitors to stop and take a look; at the same time, the customer zone paid tribute to the behind-the-scenes collaborations that have caught the attention of the tech industry with photos from key moments and a milestone technology timeline.
Hon Hai Chairman Terry Gou stated, "Hon Hai is transforming into a technology manufacturing platform service provider. From testing to the final product, our vertical integration and precision manufacturing make the impossible possible. We are building this capability in ecosystems such as smart consumer electronics, AI, electric vehicles, as well as aerospace and robotics."
Among the HHTD26 record-breaking 321 exhibits, a quarter came from the "Token Factory" zone. This zone showcased ultimate collaborative design through a 20-meter-long display wall, featuring the PCB equipped with tens of thousands of micron-level precision engineering components; the AI server computing tray design that achieves cable-free, hose-free, and fan-free operation in a single unit; the next-generation AI large-scale trend co-packaged optics ( CPO ); as well as reimagined power, cooling, and high-speed data solutions to enhance the efficiency of AI infrastructure.
An immersive simulation in the AI data hall demonstrates how AI computing power, network, electricity, and cooling work together in the design of the AI factory, including the power distribution for NVIDIA 800 VDC. Hon Hai's business department focused on AI supercomputing and cloud operations, along with its NVIDIA cloud partners Visionbay.ai, is planning to design the facilities according to the NVIDIA DSX MaxLPS principles in order to maximize the performance per watt in the AI factory within a fixed power supply limit, and to optimize the configuration of computing power, electricity, and cooling before construction.
At the event site, NVIDIA, Google LLC, and Schneider Electric discussed AI infrastructure; Honda R&D (Honda R & D Co Ltd) and Mitsubishi Electric Mobility (Mitsubishi Electric Mobility) discussed the next generation of electric mobility. The exhibition area in HHTD26 that features the most "embodied intelligence" elements is located in the zone dedicated to human-robot interactions, showcasing the growing potential of the ecosystem and demonstrating real-world application cases of industrial products in robots.
In another debut presentation, Hon Hai emphasized its extensive expertise in ultra-precision manufacturing processes, which are supported by the company's own machining, material processing, and mold manufacturing equipment. The precision manufacturing zone showcased a number of technologies that have been applied to the one-piece molded casings that accompany Poketomo AI robots and laptops.
Among all the exhibits, AI security is a theme that runs throughout. The Hon Hai team demonstrated how NVIDIA Open Agent Safety Platform supports intelligent healthcare, intelligent manufacturing, and robot safety, as well as the security of intelligent entities in smart cities.
HHTD26 will be held on October 30th and 31st at the 1st and 4th floors of Hall 1 of the Nangang Exhibition Center in Taipei. For the first time, this two-day annual conference has introduced a family-oriented exhibition area, allowing children to personally experience and explore topics such as sustainable development, travel, smart factories, and smart cities.
For more information about Hon Hai Technology's 2026 plans, please see here.
For more information about Hon Hai, see here.
Source: Hon Hai Technology Group ( Foxconn )
