IT News on September 27th: According to a report by the Taiwanese media Free Times, sources in the semiconductor supply chain indicate that TSMC plans to add 5 new advanced chip packaging factories in Chiayi Science Park.
According to the information, TSMC has planned two advanced packaging factories, P1 and P2, in Phase I of Jiako. Among them, P1 has already started mass production, and P2 has entered the equipment installation phase. Phase II of Jiako includes the planning for P3, P4, and P5 factories, among which P3 has successfully commenced construction, with the plan to complete all construction tasks for Phase II by 2031.
It is reported that with the explosive growth in demand for advanced packaging technologies such as wafer-level chip packaging from global technology giants like NVIDIA, AMD, and Apple, TSMC's current capacity expansion efforts are still not sufficient to fully fill the long-term market supply gap.
Industry insiders revealed that TSMC will build an additional 5 advanced packaging factories in Phase III of Chiayi Science Park. By then, the total number of TSMC packaging factories within Chiayi Science Park will reach 10.
IT has learned that, in accordance with the relevant procedures, this expansion plan will first be publicly displayed for one month to solicit public opinions, followed by a feasibility study and environmental assessment phase.
